The semiconductor industry paradigm is shifting toward integrated optimization rather than the superiority of individual technologies. In response to this trend, SK Hynix has significantly strengthened the role of the Device Tech Solution (DTS) organization under its Future Technology Research Institute, which organically connects devices, processes, and designs. Son Yun-ik, a Vice President at SK Hynix, emphasized that the "power of connection"—breaking down boundaries between technologies—is the core driving force behind creating a "super gap" in the AI memory market.

The DTS organization serves as a central hub, ensuring that the target performance set during the design phase is realized without distortion during actual device and process implementation. This strategy aims to realize Design Technology Co-Optimization (DTCO), a critical integrated optimization technology that many semiconductor companies are prioritizing. By considering process characteristics from the design stage, SK Hynix aims to reduce R&D costs and establish a system for the timely supply of high-performance products. This approach is intended to solidify the company's leadership in next-generation AI memory fields, including HBM and LPDDR.

Regarding technical achievements, SK Hynix has applied High-K Metal Gate (HKMG) transistor technology to peripheral circuit areas to enhance the performance of premium memory. This provides the technical foundation to stably implement the high-speed, low-power, and high-quality characteristics essential for AI memory. Furthermore, the company has advanced a system to preemptively manage quality issues at the wafer level during the early stages of technology development. By internalizing AI-based analysis capabilities during R&D, the plan is to minimize risks during the mass production stage.

Vice President Son Yun-ik expressed his ambition to leap forward as a "Full Stack AI Memory Creator" based on flexible thinking and execution, despite the rapid pace of change in the AI era. This signifies the goal of establishing SK Hynix as a core technology partner that determines AI performance, rather than remaining a mere memory supplier. He underscored that the depth of technology stems from trust and a spirit of challenge among employees, noting that the company will continue its technological leadership through an organizational culture that does not fear failure.

The semiconductor industry paradigm is shifting toward integrated optimization rather than the superiority of individual technologies. In response to this trend, SK Hynix has significantly strengthened the role of the Device Tech Solution (DTS) organization under its Future Technology Research Institute, which organically connects devices, processes, and designs. Son Yun-ik, a Vice President at SK Hynix, emphasized that the "power of connection"—breaking down boundaries between technologies—is the core driving force behind creating a "super gap" in the AI memory market.

The DTS organization serves as a central hub, ensuring that the target performance set during the design phase is realized without distortion during actual device and process implementation. This strategy aims to realize Design Technology Co-Optimization (DTCO), a critical integrated optimization technology that many semiconductor companies are prioritizing. By considering process characteristics from the design stage, SK Hynix aims to reduce R&D costs and establish a system for the timely supply of high-performance products. This approach is intended to solidify the company's leadership in next-generation AI memory fields, including HBM and LPDDR.

Regarding technical achievements, SK Hynix has applied High-K Metal Gate (HKMG) transistor technology to peripheral circuit areas to enhance the performance of premium memory. This provides the technical foundation to stably implement the high-speed, low-power, and high-quality characteristics essential for AI memory. Furthermore, the company has advanced a system to preemptively manage quality issues at the wafer level during the early stages of technology development. By internalizing AI-based analysis capabilities during R&D, the plan is to minimize risks during the mass production stage.

Vice President Son Yun-ik expressed his ambition to leap forward as a "Full Stack AI Memory Creator" based on flexible thinking and execution, despite the rapid pace of change in the AI era. This signifies the goal of establishing SK Hynix as a core technology partner that determines AI performance, rather than remaining a mere memory supplier. He underscored that the depth of technology stems from trust and a spirit of challenge among employees, noting that the company will continue its technological leadership through an organizational culture that does not fear failure.